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FULL PITCH MINI-FLAT PACKAGE 4-PIN OPTOCOUPLERS
HMA121
DESCRIPTION
The HMA series consists of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a compact 4-pin mini-flat package. The lead pitch is 2.54 mm. The HMAA series consists of two gallium arsenide infrared emitting diodes, connected in inverse parallel, driving a single silicon phototransistor in a compact 4-pin mini-flat package.
HMA124
HMA2701
HMAA2705
FEATURES
* Compact 4-pin package (2.4 mm maximum standoff height) * Current Transfer Ratio in selected groups HMAA2705: 50-300% HMA121: 50-600% HMA2701: 50-300% HMA124: 100% MIN * Available in tape and reel quantities of 500 and 2500. * Applicable to Infrared Ray reflow (230C max, 30 seconds.) * BSI (File #8611/8612), CSA (File #1162301), UL (File #E90700) and VDE (File #136480) certified
PACKAGE DIMENSIONS
PIN 1
0.100 (2.54) TYP
0.020 (0.51) 0.012 (0.30) 0.287 (7.29) 0.248 (6.30) 0.173 (4.40) TYP
APPLICATIONS
HMAA series * AC line monitor * Unknown polarity DC sensor * Telephone line receiver HMA series * Digital logic inputs * Microprocessor inputs * Power supply monitor * Twisted pair line receiver * Telephone line receiver
1 4 COLLECTOR 2 3 EMITTER
0.169 (4.29) 0.154 (3.91) 0.094 (2.39) 0.079 (2.01)
Equivalent Circuit (HMAA2705)
0.035 (0.89) 0.012 (0.30)
ANODE 1 4 COLLECTOR
0.008 (0.20) 0.000 (0.0)
0.033 (0.85) 0.026 (0.65)
CATHODE 2
3 EMITTER
Equivalent Circuit (HMA2701, HMA121, HMA124)
NOTE All dimensions are in inches (millimeters)
ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise specified)
Parameter TOTAL PACKAGE Storage Temperature Operating Temperature EMITTER Continuous Forward Current Peak Forward Current (1 s pulse, 300 pps.) Reverse Input Voltage (HMA) Power Dissipation Derate linearly (above 25C) DETECTOR Continuous Collector Current Power Dissipation Derate linearly (above 25C) Collector-Emitter Voltage Emitter-Collector Voltage
(c) 2003 Fairchild Semiconductor Corporation
Symbol TSTG TOPR IF (avg) IF (pk) VR PD
Value -55 to +150 -55 to +100 50 1 6 70 0.65 80 150 2.0 40 80 7
Units C C mA A V mW mW/C mA mW mW/C V V
PD HMA2701, HMAA2705 HMA121, HMA124 VCEO VECO Page 1 of 8
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FULL PITCH MINI-FLAT PACKAGE 4-PIN OPTOCOUPLERS
HMA121 HMA124 HMA2701 HMAA2705
ELECTRICAL CHARACTERISTICS (TA = 25C) INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter EMITTER Forward Voltage Test Conditions (IF = 10 mA) (IF = 5 mA) (IF = 5 mA) Reverse Current DETECTOR Breakdown Voltage Collector to Emitter Emitter to Collector Collector Dark Current Capacitance (VR = 5 V) IR VF Symbol Device HMA121 HMA124 HMA2701 HMAA2705 HMA2701 HMA121 HMA124 HMA121 HMA124 HMA2701 HMAA2705 All All All 10 Min 1.0 Typ** Max 1.3 V 1.4 Unit
5
A
80 40 7 100 nA pF V
(IC = 1 mA, IF = 0)
BVCEO
(IE = 100 A, IF = 0) (VCE = 40 V, IF = 0) (VCE = 0 V, f = 1 MHz)
BVECO ICEO CCE
TRANSFER CHARACTERISTICS (TA = 25C)
Characteristic Test Conditions (IF = 5 mA, VCE = 5 V) (IF = 5 mA, VCE = 5 V) DC Current Transfer Ratio (IF = 5 mA, VCE = 5 V) (IF = 1 mA, VCE = 0.5 V) (IF = 0.5 mA, VCE = 1.5 V) CTR Symmetry (IF = 5 mA, VCE = 5 V) (IF = 10 mA, IC = 2 mA) Saturation Voltage (IF = 10 mA, IC = 2 mA) (IF = 8 mA, IC = 2.4 mA) (IF = 1 mA, IC = 0.5 mA) Rise Time (Non-Saturated) Fall Time (Non-Saturated) (IC = 2 mA, VCE = 5 V) (RL = 100V) (IC = 2 mA, VCE = 5 V) (RL = 100V) tr tf VCE (SAT) -- CTR Symbol Device HMAA2705 HMA2701 HMA121 HMA124 HMA124 HMAA2705 HMAA2705 HMA2701 HMA121 HMA124 3 s 3 Min 50 50 50 100 50 0.3 Typ** Max 300 300 600 1200 -- 3.0 0.3 0.3 0.4 0.4 V % Unit
ISOLATION CHARACTERISTICS
Characteristic Steady State Isolation Voltage ** All typicals at TA = 25C
(c) 2003 Fairchild Semiconductor Corporation
Test Conditions (1 Minute)
Symbol VISO
Device All
Min 3750
Typ**
Max
Unit VRMS
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FULL PITCH MINI-FLAT PACKAGE 4-PIN OPTOCOUPLERS
HMA121 HMA124 HMA2701 HMAA2705
TYPICAL PERFORMANCE CURVES
Fig. 1 Forward Current vs. Forward Voltage
100 TA = 25C 100 TA = 25C
Fig. 2 Collector Current vs. Forward Current
IC - COLLECTOR CURRENT (mA)
IF - FORWARD CURRENT (mA)
VCE = 10V VCE = 5V 10
10
VCE = 0.4V
1
1 0.6 0.8 1.0 1.2 1.4 1.6
0.1 1 10 100
VF - FORWARD VOLTAGE (V)
IF - FORWARD CURRENT (mA)
Fig. 3 Current Transfer Ratio vs. Forward Current
IC / IF - CURRENT TRANSFER RATIO (%)
TA = 25C 100
Fig. 4 Collector Current vs. Temperature
VCE = 5 V
IC - COLLECTOR CURRENT (mA)
IF = 25 mA
VCE = 10V VCE = 5V
10
IF = 10 mA IF = 5 mA
100 VCE = 0.4V
IF = 1 mA 1
IF = 0.5 mA
10 1 10 100
0.1 -20 0 20 40 60 80 100
IF - FORWARD CURRENT (mA)
TA - AMBIENT TEMPERATURE (C)
Fig. 5 Collector Current vs. Collector-Emitter Voltage
40 TA = 25C
IC - COLLECTOR CURRENT (mA)
IF = 50 mA IF = 40 mA IF = 30 mA IF = 20 mA 20 IF = 10 mA
30
10
IF = 5 mA
IF = 1 mA 0 0 2 4 6 8 10
VCE - COLLECTOR-EMITTER VOLTAGE (V)
(c) 2003 Fairchild Semiconductor Corporation
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FULL PITCH MINI-FLAT PACKAGE 4-PIN OPTOCOUPLERS
HMA121 HMA124 HMA2701 HMAA2705
Fig. 6 Collector Current vs. Collector-Emitter Voltage
20 TA = 25C 10
Fig. 7 Collector Dark Current vs. Temperature
ICEO - COLLECTOR DARK CURRENT (A)
IC - COLLECTOR CURRENT (mA)
IF = 50 mA 15 IF = 40 mA IF = 30 mA IF = 20 mA 10 IF = 10 mA IF = 5 mA IF = 2 mA IF = 0.5 mA 0 0.0 0.2 0.4 0.6 IF = 1 mA 0.8 1.0
1
VCE = 48 V
0.1 VCE = 24 V 0.01
VCE = 10 V VCE = 5 V
5
0.001
0
20
40
60
80
100
120
VCE - COLLECTOR-EMITTER VOLTAGE (V)
TA - AMBIENT TEMPERATURE (C)
Fig. 8 Switching Time vs. Load Resistance
1000 TA = 25C IF = 16 mA VCC = 5 V
Fig. 9 Collector-Emitter Saturation Voltage vs. Temperature
0.24
tOFF
VCE (sat) - COLLECTOR-EMITTER SATURATION VOLTAGE (V)
IF = 5 mA IC = 1mA 0.20
SWITCHING TIME (s)
100 ts
0.16
10
tON 1
0.12
0.08 0.1 1
10
100
-40
-20
0
20
40
60
80
100
RL - RESISTANCE (k)
TA - AMBIENT TEMPERATURE (C)
(c) 2003 Fairchild Semiconductor Corporation
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FULL PITCH MINI-FLAT PACKAGE 4-PIN OPTOCOUPLERS
HMA121 HMA124 HMA2701 HMAA2705
ORDERING INFORMATION
Option V R1 R2 R1V R2V Description VDE Approved Tape and Reel (500 units) Tape and Reel (2500 units) Tape and Reel (500 units) and VDE Approved Tape and Reel (2500 units) and VDE Approved
MARKING INFORMATION
1
121 V X YY M
3 4 5
2 6
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) One digit year code Two digit work week ranging from `01' to `53' Assembly package code
(c) 2003 Fairchild Semiconductor Corporation
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FULL PITCH MINI-FLAT PACKAGE 4-PIN OPTOCOUPLERS
HMA121 HMA124 HMA2701 HMAA2705
K0
t
P0
P 2
D0 E
A0 W1 B0 F
W
d
P
2.54 Pitch Description Tape Width Tape Thickness Sprocket Hole Pitch Sprocket Hole Dia. Sprocket Hole Location Pocket Location Symbol W t P 0 D0 E F P 2 Pocket Pitch Pocket Dimension P A0 B0 K0 Pocket Hole Dia. Cover Tape Width Cover Tape Thickness Max. Component Rotation or Tilt D1 W 1 d
D1
Dimensions (mm) 12.000.4 0.300.20 4.000.20 1.550.20 1.750.20 5.500.20 2.000.20 8.000.20 4.400.20 7.300.20 2.300.20 1.550.20 9.20 0.0650.02 20 max
Devices Per Reel
R1 R2
500 2500 178 mm (7") 330 mm (13")
Reel Diameter
R1 R2
(c) 2003 Fairchild Semiconductor Corporation
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FULL PITCH MINI-FLAT PACKAGE 4-PIN OPTOCOUPLERS
HMA121 HMA124 HMA2701 HMAA2705
Footprint Drawing for PCB Layout
0.024 (0.61)
0.060 (1.52)
0.310 (7.87)
0.190 (4.83)
0.100 (2.54)
Recommended Infrared Reflow Soldering Profile
(heating) to 30 s Package Surface Temperature T (C) 230C (peak temperature) 210C 180C to 60 s
150 s Time (s)
90 s
60 s
* Peak reflow temperature: 230C (package surface temperature) for 30 seconds * Time of temperature higher than 210C: 60 seconds or less * One time soldering reflow is recommended
(c) 2003 Fairchild Semiconductor Corporation
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FULL PITCH MINI-FLAT PACKAGE 4-PIN OPTOCOUPLERS
HMA121 HMA124 HMA2701 HMAA2705
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
(c) 2003 Fairchild Semiconductor Corporation
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3/31/03

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